Program Director

3D Integration Program Director – Lead Innovation in Telecom & AI

Location: Leuven, Belgium

Are you an expert in 3D integration, semiconductor manufacturing, and cutting-edge materials? Ready to drive innovation in AI, 5G, and next-gen networking? We’re looking for a 3D Integration Program Director to lead high-impact R&D projects that shape the future of telecom and beyond!

What You’ll Do:

- Lead breakthrough projects in AI/CPU, networking, and 3D engineering.

- Design and implement cutting-edge 3D engineering architectures.

- Turn complex ideas into reality by managing risks and executing technical roadmaps.

- Collaborate globally with top industry experts to push the boundaries of 3D technologies.

- Apply your expertise in 3D IC, advanced packaging, chip stacking, and semiconductor tech.

What You Bring:

- PhD in Engineering, Materials Science, or a related field.

- 10+ years of experience in 3D integration, semiconductor manufacturing, or advanced materials.

- Deep knowledge of 3D IC technologies, heterogeneous integration, MEMS, and chip stacking.

- Strong leadership & communication skills to work with top-tier researchers and engineers.

- A problem-solving mindset with the ability to manage complex, high-stakes projects.

Why Join Us?

- Work at the forefront of innovation in AI, 5G, and advanced networking.

- Collaborate with global experts and lead game-changing research.

- Be part of a company driving next-gen digital transformation.

Are you ready to lead the future of 3D integration? Apply now and let’s innovate together!